PRODUCTS & TECHNOLOGY

Wafer Cleaning Equipment

Includes automated post-grinding and post-resist-strip wafer cleaning equipment for 150, 200 and 300 mm wafers, with horizontal cleaning chambers and automated wafer handling.

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Product Overview

For cleaning after wafer grinding or photoresist stripping, with configurations for 150, 200 and 300 mm wafers.
Equipped with two or three load ports and a dual-arm wafer-handling robot.
Horizontal cleaning chambers, with up to eight chambers configured to requirements.
Independent cleaning-chemical control and a precision nozzle chemical-flow control system.
Industrial touchscreen control and industrial IoT configuration software, with SECS/GEM communication and data transfer.

Equipment configurations can be tailored to requirements. Contact us for detailed specifications, process performance and test conditions.

Applications

Cleaning steps in wafer processing and advanced packaging.

Who it is for

Wafer processing, semiconductor packaging and process engineering teams.

Discuss your configuration

Tell us your substrate material, dimensions, metal layers and process objectives. We can discuss the relevant equipment one to one, provide more detailed PDF literature and clarify configurations and technical details.

LET’S TALK

Let’s start with your process.

Contact CMO