PRODUCTS & TECHNOLOGY
From wafers to panels, from electroplating to cleaning. Explore our equipment areas and discuss the right approach for your process.
9 product areas
ECP-series automated horizontal wafer electroplating equipment for TSV, pillar, bump, RDL and copper damascene processes, with configurations for 150, 200 and 300 mm wafers.
Explore applicationsECP-series automated vertical wafer electroplating equipment for TGV, TSV, pillar, bump and RDL processes, using vertical chambers and fully automated double-sided fixtures.
Explore applicationsTGV copper-fill electroplating equipment for panel-level packaging, through-hole plating, double-sided plating, pillar and bump processes, using vertical plating chambers.
Explore applicationsGlass TGV etching equipment for wafer-level and panel-level packaging, with vertical etching tanks, ultrasonic cleaning and automated handling configurations.
Explore applicationsPanel-level RDL electroplating equipment uses vertical plating chambers with pre-wet, rinse and dry modules for panel-level packaging and interconnect metallisation.
Explore applicationsPretreatment and electroless copper equipment for film formation inside through-glass vias and via-wall metallisation in wafer-level and panel-level glass substrates.
Explore applicationsIncludes automated post-grinding and post-resist-strip wafer cleaning equipment for 150, 200 and 300 mm wafers, with horizontal cleaning chambers and automated wafer handling.
Explore applicationsA small-batch wafer electroplating line for pillar, bump, RDL, TSV and copper damascene processes, with compact modular horizontal chambers for development and small-batch processing.
Explore applicationsAutomated gallium arsenide wafer electroplating equipment for 4-inch and 6-inch GaAs wafers, integrating automated wafer transfer, pre-wetting, electroplating, rinsing and drying.
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