Product Overview
- Configurations are available for 150, 200 and 300 mm wafers.
- The number of chambers can be configured from one to four.
- Touchscreen HMI operation with horizontal electroplating chambers.
- A compact, modular design supports flexible configurations and maintenance.
- Plating metals include copper, nickel, gold, tin and silver.
Equipment configurations can be tailored to requirements. Contact us for detailed specifications, process performance and test conditions.