Wafer process concept illustration, not a machine photograph.

PRODUCTS & TECHNOLOGY

GaAs Wafer Electroplating

Automated gallium arsenide wafer electroplating equipment for 4-inch and 6-inch GaAs wafers, integrating automated wafer transfer, pre-wetting, electroplating, rinsing and drying.

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Product Overview

For 4-inch and 6-inch gallium arsenide wafers, including processes using semi-insulating and conductive GaAs substrates.
Application areas include wafer metallisation for RF devices, VCSEL optoelectronic devices and GaAs photovoltaic cells.
Integrates automated wafer transfer, pre-wetting, electroplating, rinsing and drying in a modular chamber design.
Supports SECS/GEM communication and closed-loop process control of chemical concentration, temperature and current density.
Process configurations address GaAs brittleness, stress and plating requirements. Contact us for detailed capacity information and test conditions.

Equipment configurations can be tailored to requirements. Contact us for detailed specifications, process performance and test conditions.

Applications

Electroplating processes for compound semiconductor wafers.

Who it is for

Compound semiconductor device manufacturers and process development teams.

Discuss your configuration

Tell us your substrate material, dimensions, metal layers and process objectives. We can discuss the relevant equipment one to one, provide more detailed PDF literature and clarify configurations and technical details.

LET’S TALK

Let’s start with your process.

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