CMO / SEMICONDUCTOR EQUIPMENT
Precision plating.
Advanced manufacturing.Engineered in-house.
Built for your process.
Wafer electroplating, advanced packaging and glass TGV.
Equipment and process solutions for plating, etching and cleaning.In-house development and industry experience, focused on reliable, easy-to-use equipment.
Equipment and process solutions shaped around your application.
Horizontal Wafer Electroplating Equipment
NEWSROOM
From development to delivery.
ENGINEERED FOR YOUR PROCESS
Meet the equipment behind the process.
CMO / 01Horizontal Wafer Electroplating Equipment
ECP-series automated horizontal wafer electroplating equipment for TSV, pillar, bump, RDL and copper damascene processes, with configurations for 150, 200 and 300 mm wafers.
Copper pillars, bumps, redistribution layers and via-related electroplating.
CMO / 02Panel-Level TGV Electroplating Equipment
TGV copper-fill electroplating equipment for panel-level packaging, through-hole plating, double-sided plating, pillar and bump processes, using vertical plating chambers.
TGV metallisation and panel-level packaging.
CMO / 03Glass TGV Etching Equipment
Glass TGV etching equipment for wafer-level and panel-level packaging, with vertical etching tanks, ultrasonic cleaning and automated handling configurations.
Through-glass via processing for wafer-level and panel-level applications.
LET’S TALK
Let’s start with your process.
Contact us for technical details, product introductions and PDF materials.
Contact CMO