Product Overview
- Configurations are available for 150, 200 and 300 mm wafers.
- Horizontal plating chambers with pre-wet, rinse and dry process modules; up to 12 plating chambers can be configured to requirements.
- Equipped with two or three load ports, a dual-arm wafer-handling robot and electromagnetic linear motion modules.
- Industrial touchscreen control with support for SECS/GEM communication and data transfer.
- Process configurations include copper, nickel, gold and tin/silver plating.
Equipment configurations can be tailored to requirements. Contact us for detailed specifications, process performance and test conditions.