Product Overview
- For panel-level packaging, through-glass via plating and copper filling, with configurations tailored to substrates and process requirements.
- Vertical plating chambers provide maintenance access; up to 15 plating chambers can be configured to requirements.
- Equipped with three rinse chambers.
- Industrial touchscreen operation and industrial IoT configuration software, with SECS/GEM communication and data transfer.
- Process configurations address dense copper via filling, interconnect resistance and signal integrity. Contact us for fill results and test conditions.
Equipment configurations can be tailored to requirements. Contact us for detailed specifications, process performance and test conditions.