PRODUCTS & TECHNOLOGY

Panel-Level RDL Electroplating Equipment

Panel-level RDL electroplating equipment uses vertical plating chambers with pre-wet, rinse and dry modules for panel-level packaging and interconnect metallisation.

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Product Overview

For panel-level packaging and related through-hole and double-sided plating processes, with substrate dimensions configured to requirements.
Vertical plating chambers provide maintenance access.
Includes one pre-wet chamber and up to 12 plating chambers.
Equipped with three rinse chambers and one dry chamber.
Industrial touchscreen control and industrial IoT configuration software, with SECS/GEM communication and data transfer.

Equipment configurations can be tailored to requirements. Contact us for detailed specifications, process performance and test conditions.

Applications

Redistribution layers and related panel-level metal deposition processes.

Who it is for

Panel-level packaging, interconnect substrate and process engineering teams.

Discuss your configuration

Tell us your substrate material, dimensions, metal layers and process objectives. We can discuss the relevant equipment one to one, provide more detailed PDF literature and clarify configurations and technical details.

LET’S TALK

Let’s start with your process.

Contact CMO