Product Overview
- Configurations are available for 150, 200 and 300 mm wafers.
- Vertical plating chambers and fully automated double-sided fixtures support automated processing and maintenance access.
- Includes a pre-wet chamber, up to 12 plating chambers, and rinse and dry chambers.
- Equipped with two or three load ports, a dual-arm wafer-handling robot and electromagnetic linear motion modules.
- Industrial touchscreen control and SECS/GEM communication; plating metals include copper, nickel, gold, tin and silver.
Equipment configurations can be tailored to requirements. Contact us for detailed specifications, process performance and test conditions.