Product Overview
- Electroplating pretreatment equipment serves film-formation processes inside TGVs in wafer-level and panel-level glass substrates.
- The electroless copper line is used for film formation and metallisation inside TGVs in panel-level glass substrates.
- Glass substrate length and width each range from 200 to 615 mm, with thickness from 0.3 to 2 mm. Confirm the applicable range for your process.
- Please discuss via diameter, aspect ratio, film coverage and integration with preceding and subsequent process steps for your substrate and application.
Equipment configurations can be tailored to requirements. Contact us for detailed specifications, process performance and test conditions.