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Wafer-Level Plating Uniformity Test

Deposit thickness at the 41 measuring points

Plating uniformity: 97.04%

Test conditions

Test board: 6-inch; 0.55 mm thick
Current density: 2 ASD
Plating time: 25 min
Measuring points: 41 per side
Instrument: BOWMAN copper thickness gauge (USA)

Original test data

Wafer-level plating uniformity test: 41-point thickness data

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