PROCESS CONSULTATION
Let’s discuss your process.
Discuss materials, metal layers, substrates and process objectives to identify relevant equipment.
Electroplating & Metallisation
Discuss wafer electroplating, copper pillars and bumps, redistribution layers, via plating and filling requirements.
TGV Etching & Pretreatment
Discuss through-glass via formation, via-wall metallisation and associated pretreatment in the context of your process.
Cleaning & Equipment Configuration
Cleaning steps, equipment layout and related configurations depend on your materials and process conditions. Contact us for detailed introductions and PDF literature.
LET’S TALK
Let’s start with your process.
Contact us for technical details, product introductions and PDF materials.
Contact CMO